TCT 716 Lambda
Thermal Conductivity Tester
Between Classical Heat Flow Meters and Laser Flash Analyzers
The TCT 716 Lambda offers the ability to analyze specimens with optimum dimensions: smaller than conventional HFM and larger than LFA. This enables investigations of homogeneous and inhomogeneous materials with thermal conductivity values ranging from low to medium.
Advantages of the Guarded Heat Flow Meter
The Guarded Heat Flow Meter (GHFM) provides a reliable and precise method for measuring thermal conductivity and thermal resistance of solids, thus contributing to research and product development.
- Two independent test stacks
- High accuracy: uncertainties are typically < 3%
- Non-destructive test
- Wide range of materials: metals, polymers, ceramics, composites, etc.
- Specimen dimensions: 50,8 mm (2 in) in diameter, up to 31.8-mm (1 1/4 in) in thickness – advantageous for inhomogeneous samples
- Easy handling: minimal training required
Technical Data
Cooling System
Two Independent Test Stacks
Temperature Range
Sample mean temperature range: -10°C to 300°C
Thermal Conductivity Range
0.1 ... approx. 45 W/(m·K) (using proper sample thicknesses)
Thermal Resistance Range
0.0010 ... 0.030 m2·K/W
Thermal Conductivity Accuracy
±3% deviation from literature value
Thermal Conductivity Repeatability
±2% (precision; measurement of the same sample in the same device after sample out/in between measurements)
Number of Set Points
Free-selectable number of programmable test temperatures; typically full range test includes 5 to 6 test temperatures max.
Number and Type of Temperature Sensors
Premium RTD class A, in protective capsule, 14 total/instrument, resolution: 0.01°C, RTD temperature accuracy: ± 0.1°C
Standard
Based on standards such as ASTM E1530
Unbeatable Features of the TCT 716 Lambda
Realizing Precise Determination of Thermal Resistance and Thermal Conductivity
Knowledge of the thermal conductivity and thermal resistance is important for metals, polymers, and composites because it helps engineers and scientists design and develop materials and products that can withstand high temperatures and thermal stress.
Thermal resistance is the ability of a material to resist the flow of heat through it, and it is a critical parameter for materials used in applications such as electronics, aerospace, automotive, and energy systems.
In electronics, for example, thermal resistance is a key factor in determining the reliability and performance of electronic devices such as microprocessors, which generate significant amounts of heat.
If the thermal resistance of the material used in a device is too high, it can lead to overheating, reduced performance, and ultimately failure of the device. Therefore, materials with low thermal resistance are preferred for electronic applications.
Similarly, in aerospace and automotive applications, materials with high thermal resistance are required, to withstand the high temperatures generated during operation. Materials such as titanium alloys, carbon composites, and ceramics are commonly used in these applications due to their high thermal resistance.
Overall, an understanding of the thermal resistance is crucial in selecting materials for various applications, ensuring product reliability and performance, and optimizing design and manufacturing processes.
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